TMP19A61F10XBG vs MC9328MX21DVG feature comparison

TMP19A61F10XBG Toshiba America Electronic Components

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MC9328MX21DVG Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, BGA289,20X20,20 14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, MAPBGA-289
Pin Count 289 289
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature SEATED HGT-NOM
Address Bus Width 24 26
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 13.5 MHz 32 MHz
External Data Bus Width 16 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PBGA-B289 S-PBGA-B289
Length 11 mm 14 mm
Low Power Mode YES YES
Number of Terminals 289 289
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA289,20X20,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (bytes) 49152
ROM (words) 1048576
ROM Programmability FLASH
Seated Height-Max 1.06 mm 1.49 mm
Speed 54 MHz 266 MHz
Supply Current-Max 49 mA
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.35 V 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
ECCN Code 3A991.A.2
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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