TMP19A61C10XBG
vs
MC9328MX21VK
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA, BGA289,20X20,20
|
14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-289
|
| Pin Count |
289
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
SEATED HGT-NOM
|
ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US
|
| Address Bus Width |
24
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
13.5 MHz
|
32 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
| Length |
11 mm
|
14 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
289
|
289
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA289,20X20,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
49152
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
MROM
|
|
| Seated Height-Max |
1.06 mm
|
1.49 mm
|
| Speed |
54 MHz
|
266 MHz
|
| Supply Current-Max |
49 mA
|
|
| Supply Voltage-Max |
1.65 V
|
1.65 V
|
| Supply Voltage-Min |
1.35 V
|
1.45 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
5A992.C
|
| Factory Lead Time |
|
2 Days
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare TMP19A61C10XBG with alternatives
Compare MC9328MX21VK with alternatives