TMP19A61C10XBG
vs
MC9328MX21CVM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
End Of Life
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
TFBGA, BGA289,20X20,20
14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-289
Pin Count
289
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
SEATED HGT-NOM
ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US
Address Bus Width
24
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
13.5 MHz
32 MHz
External Data Bus Width
16
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B289
S-PBGA-B289
Length
11 mm
17 mm
Low Power Mode
YES
YES
Number of Terminals
289
289
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA289,20X20,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
49152
ROM (words)
1048576
ROM Programmability
MROM
Seated Height-Max
1.06 mm
1.6 mm
Speed
54 MHz
266 MHz
Supply Current-Max
49 mA
Supply Voltage-Max
1.65 V
1.65 V
Supply Voltage-Min
1.35 V
1.45 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
2
ECCN Code
5A002.A.1
Factory Lead Time
52 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
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