TMC2111AB2C
vs
TMC2111B2V
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
TRW LSI PRODUCTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP24,.3
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
30 MHz
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
R-GDIP-T24
|
R-XDIP-T24
|
| Low Power Mode |
NO
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Data Bus Width |
8
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
NOT SPECIFIED
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, PIPELINE REGISTER
|
|
| Base Number Matches |
5
|
3
|
| Rohs Code |
|
No
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Max Frequency@Nom-Sup |
|
30000000 Hz
|
| Number of Bits |
|
1
|
| Number of Functions |
|
8
|
| Package Equivalence Code |
|
DIP24,.3
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare TMC2111B2V with alternatives