TMC2011AB2C vs TMC2011AB2C feature comparison

TMC2011AB2C Fairchild Semiconductor Corporation

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TMC2011AB2C Raytheon Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP RAYTHEON SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.39.00.01
Boundary Scan NO NO
Clock Frequency-Max 30 MHz 30 MHz
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Low Power Mode NO NO
Number of Terminals 24 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Data Bus Width 8 8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches 2 2

Compare TMC2011AB2C with alternatives

Compare TMC2011AB2C with alternatives