TLZ30D-GS08
vs
VLZ30D-GS18
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY SEMICONDUCTORS
|
Package Description |
MELF-2
|
O-LELF-R2
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
9 Weeks
|
|
Additional Feature |
HIGH RELIABILITY, LOW NOISE
|
HIGH RELIABILITY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
55 Ω
|
55 Ω
|
JEDEC-95 Code |
DO-213AA
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e2
|
e2
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
29.77 V
|
29.77 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin/Silver (Sn97.5Ag2.5)
|
Tin/Silver (Sn97.5Ag2.5)
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Voltage Tol-Max |
2.5%
|
3%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
|
|
|
Compare TLZ30D-GS08 with alternatives
Compare VLZ30D-GS18 with alternatives