TLV9062IDGKT
vs
MCP6022-E/SN
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TSSOP,
|
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2017-09-27
|
|
Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Common-mode Reject Ratio-Min |
57 dB
|
74 dB
|
Common-mode Reject Ratio-Nom |
103 dB
|
90 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
1600 µV
|
2500 µV
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e3
|
Length |
3 mm
|
4.9 mm
|
Low-Bias |
YES
|
YES
|
Low-Offset |
NO
|
NO
|
Micropower |
YES
|
NO
|
Moisture Sensitivity Level |
2
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Packing Method |
TR, 13 INCH
|
TUBE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power |
NO
|
NO
|
Programmable Power |
NO
|
NO
|
Seated Height-Max |
1.1 mm
|
1.75 mm
|
Slew Rate-Nom |
6.5 V/us
|
7 V/us
|
Supply Current-Max |
1.6 mA
|
2.7 mA
|
Supply Voltage Limit-Max |
6 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Unity Gain BW-Nom |
10000
|
10000
|
Voltage Gain-Min |
158489.3192
|
31620
|
Wideband |
NO
|
NO
|
Width |
3 mm
|
3.91 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Factory Lead Time |
|
5 Weeks
|
Average Bias Current-Max (IIB) |
|
0.005 µA
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
TS 16949
|
|
|
|
Compare TLV9062IDGKT with alternatives
Compare MCP6022-E/SN with alternatives