TLV9002QDGKRQ1
vs
MCP6062-E/MNY
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP, TSSOP8,.20
|
HVSON,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Date Of Intro |
2020-06-11
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Common-mode Reject Ratio-Min |
63 dB
|
|
| Common-mode Reject Ratio-Nom |
90 dB
|
91 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
1500 µV
|
150 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVSON
|
| Package Equivalence Code |
TSSOP8,.25
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Slew Rate-Nom |
2 V/us
|
0.25 V/us
|
| Supply Current-Max |
0.17 mA
|
|
| Supply Voltage Limit-Max |
6 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Unity Gain BW-Nom |
1000
|
730
|
| Voltage Gain-Min |
158489.3
|
|
| Wideband |
NO
|
|
| Width |
3 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
8
|
| Average Bias Current-Max (IIB) |
|
0.005 µA
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare TLV9002QDGKRQ1 with alternatives
Compare MCP6062-E/MNY with alternatives