TLV70533YFFR
vs
NCP702MX33TCG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ONSEMI
|
| Part Package Code |
BGA
|
XDFN6 1.5X1.5, 0.5P
|
| Package Description |
0.80 X 0.80 MM, 0.625 MM HEIGHT, GREEN, DSBGA-4
|
XDFN-6
|
| Pin Count |
4
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
onsemi
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.25 V
|
0.2 V
|
| Dropout Voltage1-Nom |
0.145 V
|
0.14 V
|
| Input Voltage Absolute-Max |
6 V
|
6 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2 V
|
2 V
|
| JESD-30 Code |
S-XBGA-B4
|
S-PDSO-N6
|
| JESD-609 Code |
e1
|
|
| Length |
1.2 mm
|
1.5 mm
|
| Line Regulation-Max |
0.005%
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
6
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current1-Max |
0.2 A
|
0.2 A
|
| Output Voltage1-Max |
3.366 V
|
3.366 V
|
| Output Voltage1-Min |
3.234 V
|
3.234 V
|
| Output Voltage1-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VSON
|
| Package Equivalence Code |
BGA4,2X2,16
|
SOLCC6,.06,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.625 mm
|
0.45 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
NICKEL GOLD PALLADIUM
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Voltage Tolerance-Max |
2%
|
2%
|
| Width |
1 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
711AE
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare TLV70533YFFR with alternatives
Compare NCP702MX33TCG with alternatives