TLV6002IDGKR
vs
MCP6002T-I/SNVAO
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VSSOP-8
|
SOP, SOP8,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2016-06-19
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.000076 µA
|
|
| Bias Current-Max (IIB) @25C |
0.000076 µA
|
|
| Common-mode Reject Ratio-Min |
60 dB
|
60 dB
|
| Common-mode Reject Ratio-Nom |
76 dB
|
76 dB
|
| Input Offset Voltage-Max |
4500 µV
|
4500 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
2
|
|
| Neg Supply Voltage Limit-Max |
-3.5 V
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.5 V/us
|
0.6 V/us
|
| Supply Current-Max |
0.2 mA
|
0.34 mA
|
| Supply Voltage Limit-Max |
3.5 V
|
7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.33.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Frequency Compensation |
|
YES
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Package Equivalence Code |
|
SOP8,.25
|
| Packing Method |
|
TR
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
AEC-Q100; TS 16949
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Technology |
|
CMOS
|
| Voltage Gain-Min |
|
25118.86
|
| Wideband |
|
NO
|
|
|
|
Compare TLV6002IDGKR with alternatives
Compare MCP6002T-I/SNVAO with alternatives