TLV4021R1YKAR
vs
MAX40002ANS02+
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
VFBGA,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Bias Current-Max (IIB) @25C |
0.005 µA
|
0.03 µA
|
| Input Offset Voltage-Max |
4000 µV
|
32000 µV
|
| JESD-30 Code |
S-XBGA-B4
|
S-XBGA-B4
|
| JESD-609 Code |
e1
|
e2
|
| Length |
0.73 mm
|
0.728 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA4,2X2,14
|
BGA4,2X2,14
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Response Time-Nom |
360 ns
|
9000 ns
|
| Seated Height-Max |
0.4 mm
|
0.5 mm
|
| Supply Current-Max |
0.005 mA
|
0.0013 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER NICKEL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.35 mm
|
0.35 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
0.73 mm
|
0.728 mm
|
| Base Number Matches |
1
|
2
|
| Average Bias Current-Max (IIB) |
|
0.09 µA
|
| Technology |
|
BICMOS
|
|
|
|
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