TLV320AIC3107IYZFT
vs
TLV320AIC3107IRSBT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
QFN
|
Package Description |
3.50 X 3 MM, 0.50 MM PITCH, GREEN, DSBGA-42
|
WQFN-40
|
Pin Count |
42
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
IT ALSO REQUIRES ANALOG SUPPLY OF 3.3V
|
IT ALSO REQUIRES ANALOG SUPPLY OF 3.3V
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
24 dB
|
|
Harmonic Distortion |
1.77%
|
1.77%
|
JESD-30 Code |
R-XBGA-B42
|
S-PQCC-N40
|
JESD-609 Code |
e1
|
e4
|
Length |
3.533 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
42
|
40
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA42,6X7,20
|
LCC40,.2SQ,16
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
1.525 V
|
1.525 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.346 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
|
|
|