TLV2761IDG4
vs
TLV2761CD
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP8,.25
GREEN, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0002 µA
0.0001 µA
Bias Current-Max (IIB) @25C
0.000015 µA
0.000015 µA
Common-mode Reject Ratio-Nom
72 dB
76 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
6800 µV
3500 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e4
Length
4.9 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Slew Rate-Min
0.07 V/us
0.07 V/us
Slew Rate-Nom
0.22 V/us
0.22 V/us
Supply Current-Max
0.03 mA
0.028 mA
Supply Voltage Limit-Max
4 V
4 V
Supply Voltage-Nom (Vsup)
2.4 V
2.4 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Unity Gain BW-Nom
500
500
Voltage Gain-Min
18000
18000
Wideband
NO
NO
Width
3.9 mm
3.9 mm
Base Number Matches
1
4
Samacsys Manufacturer
Texas Instruments
Common-mode Reject Ratio-Min
55 dB
Input Offset Current-Max (IIO)
0.000015 µA
Packing Method
TUBE
Compare TLV2761IDG4 with alternatives
Compare TLV2761CD with alternatives