TLV2432MJGB
vs
TS27L2ACP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
STMICROELECTRONICS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
TSSOP, TSSOP8,.25
Pin Count
8
8
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0003 µA
0.00015 µA
Bias Current-Max (IIB) @25C
0.00006 µA
Common-mode Reject Ratio-Nom
83 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
2500 µV
6500 µV
JESD-30 Code
R-GDIP-T8
R-PDSO-G8
Length
9.58 mm
4.4 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP8,.3
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
1.2 mm
Slew Rate-Min
0.1 V/us
Slew Rate-Nom
0.25 V/us
0.04 V/us
Supply Current-Max
0.27 mA
0.034 mA
Supply Voltage Limit-Max
12 V
18 V
Supply Voltage-Nom (Vsup)
3 V
10 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
500
100
Voltage Gain-Min
500
45000
Width
7.62 mm
3 mm
Base Number Matches
1
1
JESD-609 Code
e0
Power
NO
Programmable Power
NO
Terminal Finish
TIN LEAD
Wideband
NO
Compare TLV2432MJGB with alternatives
Compare TS27L2ACP with alternatives