TLV2354MFKB
vs
TLV2354MFK
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
CC-20
|
QCCN, LCC20,.35SQ
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.02 µA
|
0.02 µA
|
Bias Current-Max (IIB) @25C |
0.02 µA
|
|
Input Offset Voltage-Max |
5000 µV
|
10000 µV
|
JESD-30 Code |
S-CQCC-N20
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
|
Length |
8.89 mm
|
8.89 mm
|
Number of Functions |
4
|
4
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Type |
OPEN-COLLECTOR; OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QCCN
|
Package Equivalence Code |
LCC20,.35SQ
|
LCC20,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
1400 ns
|
1400 ns
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
2.03 mm
|
2.03 mm
|
Supply Current-Max |
0.6 mA
|
0.8 mA
|
Supply Voltage Limit-Max |
8 V
|
8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
8.89 mm
|
8.89 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare TLV2354MFKB with alternatives
Compare TLV2354MFK with alternatives