TLV2262CP
vs
TC1029EPA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TELCOM SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
PLASTIC, DIP-8
Pin Count
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.0008 µA
Common-mode Reject Ratio-Nom
75 dB
Input Offset Voltage-Max
3000 µV
1000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.59 mm
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Slew Rate-Nom
0.55 V/us
Supply Voltage Limit-Max
16 V
6 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
670
Width
7.62 mm
Base Number Matches
1
2
Rohs Code
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
0.0001 µA
Frequency Compensation
YES
JESD-609 Code
e0
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Package Equivalence Code
DIP8,.3
Supply Current-Max
0.016 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare TLV2262CP with alternatives