TLV2262AMJGB
vs
TLC271BCP
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
ROHS COMPLIANT, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0008 µA
|
0.00006 µA
|
| Common-mode Reject Ratio-Nom |
77 dB
|
80 dB
|
| Input Offset Voltage-Max |
1500 µV
|
3000 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| Length |
9.58 mm
|
9.59 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT APPLICABLE
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Slew Rate-Nom |
0.55 V/us
|
2.9 V/us
|
| Supply Voltage Limit-Max |
16 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
NOT SPECIFIED
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Total Dose |
MIL-STD-883 V
|
|
| Unity Gain BW-Nom |
670
|
1700
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e4
|
|
|
|
Compare TLV2262AMJGB with alternatives
Compare TLC271BCP with alternatives