TLP2066(F) vs FODM8071R2 feature comparison

TLP2066(F) Toshiba America Electronic Components

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FODM8071R2 Fairchild Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP FAIRCHILD SEMICONDUCTOR CORP
Package Description MFSOP-5/6 LEAD FREE, MINIFLAT, SOP-5
Reach Compliance Code unknown compliant
HTS Code 8541.40.80.00 8541.40.80.00
Samacsys Manufacturer Toshiba
Additional Feature OPEN COLLECTOR, UL RECOGNIZED CMOS COMPATIBLE, UL RECOGNIZED
Configuration SINGLE SINGLE
Data Rate-Nom 20 MBps 20 MBps
Forward Current-Max 0.018 A 0.02 A
Isolation Voltage-Max 3750 V 3750 V
Mounting Feature SURFACE MOUNT
Number of Elements 1 1
Number of Functions 1
On-State Current-Max 0.01 A 0.01 A
Operating Temperature-Max 100 °C 110 °C
Operating Temperature-Min -40 °C -40 °C
Optoelectronic Device Type LOGIC IC OUTPUT OPTOCOUPLER LOGIC IC OUTPUT OPTOCOUPLER
Power Dissipation-Max 0.04 W
Response Time-Nom 6e-8 ns
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.6 V
Surface Mount YES
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code MFP
Pin Count 5
Manufacturer Package Code 5LD,MFP (MINI FLAT PACKAGE),FULL-PITCH,WHITE COPLANAR
ECCN Code EAR99
JESD-609 Code e3
Terminal Finish Matte Tin (Sn)

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