TLK2711AJRZQE
vs
TLK2711HFG/EM
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA, BGA80,9X9,20
|
|
| Pin Count |
80
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
S-PBGA-B80
|
|
| JESD-609 Code |
e1
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
80
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA80,9X9,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
Compare TLK2711AJRZQE with alternatives