TLE9250LEXUMA1
vs
TJA1054AT/M,518
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
Package Description |
HTSON,
|
SOP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
20 Weeks
|
|
Samacsys Manufacturer |
Infineon
|
|
JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
8.65 mm
|
Moisture Sensitivity Level |
2A
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
14
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSON
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
1.1 mm
|
1.75 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT108-1
|
|
|
|
Compare TLE9250LEXUMA1 with alternatives
Compare TJA1054AT/M,518 with alternatives
-
TJA1054AT/M,518 vs 935261511005
-
TJA1054AT/M,518 vs PC33897EFR2
-
TJA1054AT/M,518 vs TJA1041AU/V,025
-
TJA1054AT/M,518 vs PI2C3020V
-
TJA1054AT/M,518 vs TJA1029TK,118
-
TJA1054AT/M,518 vs 935261512118
-
TJA1054AT/M,518 vs TJA1054T/N,512
-
TJA1054AT/M,518 vs MAX13054AUT
-
TJA1054AT/M,518 vs 935280866518