TLE9250LEXUMA1
vs
PI2C3020V
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
PERICOM SEMICONDUCTOR CORP
|
| Package Description |
HTSON,
|
SSOP, SSOP48,.4
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
|
| Samacsys Manufacturer |
Infineon
|
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G48
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
15.875 mm
|
| Moisture Sensitivity Level |
2A
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSON
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
2.74 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
48
|
| ECCN Code |
|
EAR99
|
| Data Rate |
|
16000 Mbps
|
| Number of Transceivers |
|
1
|
| Package Equivalence Code |
|
SSOP48,.4
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
BICMOS
|
|
|
|
Compare TLE9250LEXUMA1 with alternatives
Compare PI2C3020V with alternatives