TLE6262GNUMA1
vs
MCP2022T-330E/ST
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
TSSOP
Package Description
POWER, PLASTIC, SO-28
HTSSOP,
Pin Count
28
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G28
R-PDSO-G14
Length
18.1 mm
5 mm
Number of Functions
1
1
Number of Terminals
28
14
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
1.2 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
LIN TRANSCEIVER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.6 mm
4.4 mm
Base Number Matches
1
1
Rohs Code
ECCN Code
EAR99
Samacsys Manufacturer
Microchip
JESD-609 Code
e3
Number of Transceivers
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
TSSOP14,.25
Screening Level
TS 16949
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Compare TLE6262GNUMA1 with alternatives
Compare MCP2022T-330E/ST with alternatives