TLE6251DS vs 935261511005 feature comparison

TLE6251DS Infineon Technologies AG

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935261511005 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code SOIC DIE
Package Description PLASTIC, SO-8 DIE,
Pin Count 8 15
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
JESD-30 Code R-PDSO-G8 R-XUUC-N15
Length 5 mm
Moisture Sensitivity Level 2A
Number of Functions 1 1
Number of Terminals 8 15
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Current-Max 0.07 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 4.4 mm
Base Number Matches 1 1

Compare TLE6251DS with alternatives

Compare 935261511005 with alternatives