TLE6251DS
vs
935261511005
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
DIE
|
Package Description |
PLASTIC, SO-8
|
DIE,
|
Pin Count |
8
|
15
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Infineon
|
|
Data Rate |
1000 Mbps
|
|
JESD-30 Code |
R-PDSO-G8
|
R-XUUC-N15
|
Length |
5 mm
|
|
Moisture Sensitivity Level |
2A
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
15
|
Number of Transceivers |
1
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.75 mm
|
|
Supply Current-Max |
0.07 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Nickel/Gold/Palladium (Ni/Au/Pd)
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TLE6251DS with alternatives
Compare 935261511005 with alternatives