TLE6250C
vs
UJA1167ATK
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE,
|
HVSON-14
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
X-XUUC-N
|
R-PDSO-N14
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
HVSON
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
5 V
|
13 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
CAN TRANSCEIVER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
5
|
2
|
| Factory Lead Time |
|
15 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Data Rate |
|
5000 Mbps
|
| Length |
|
4.5 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
14
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
SOLCC14,.12,25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
28 mA
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
3 mm
|
|
|
|
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