TLE6250C vs MCP2551-I/P feature comparison

TLE6250C Infineon Technologies AG

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MCP2551-I/P Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code End Of Life Not Recommended
Ihs Manufacturer INFINEON TECHNOLOGIES AG MICROCHIP TECHNOLOGY INC
Part Package Code DIE DIP
Package Description DIE, DIP-8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code X-XUUC-N R-PDIP-T8
JESD-609 Code e3 e3
Number of Functions 1 1
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BCDMOS
Telecom IC Type CAN TRANSCEIVER CAN TRANSCEIVER
Terminal Finish MATTE TIN MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 5 1
Pbfree Code Yes
Pin Count 8
ECCN Code EAR99
Factory Lead Time 12 Weeks, 4 Days
Samacsys Manufacturer Microchip
Data Rate 1000 Mbps
Length 9.271 mm
Number of Terminals 8
Number of Transceivers 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code DIP8,.3
Screening Level TS 16949
Seated Height-Max 5.334 mm
Supply Current-Max 75 mA
Temperature Grade INDUSTRIAL
Terminal Pitch 2.54 mm
Width 7.62 mm

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