TLE6250C
vs
MCP2551-E/P
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Not Recommended
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIE
|
DIP
|
Package Description |
DIE,
|
DIP-8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
X-XUUC-N
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
1
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
DIP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BCDMOS
|
|
Telecom IC Type |
CAN TRANSCEIVER
|
CAN TRANSCEIVER
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
5
|
1
|
Pbfree Code |
|
Yes
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
27 Weeks, 4 Days
|
Samacsys Manufacturer |
|
Microchip
|
Data Rate |
|
1000 Mbps
|
Length |
|
9.271 mm
|
Number of Terminals |
|
8
|
Number of Transceivers |
|
1
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
DIP8,.3
|
Screening Level |
|
TS 16949
|
Seated Height-Max |
|
5.334 mm
|
Supply Current-Max |
|
75 mA
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare TLE6250C with alternatives
Compare MCP2551-E/P with alternatives