TLE2024BCDW
vs
NE5532AF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
DIP
Package Description
PLASTIC, SOIC-16
DIP,
Pin Count
16
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.09 µA
1 µA
Bias Current-Max (IIB) @25C
0.07 µA
Common-mode Reject Ratio-Min
93 dB
70 dB
Common-mode Reject Ratio-Nom
108 dB
100 dB
Frequency Compensation
YES
Input Offset Voltage-Max
700 µV
5000 µV
JESD-30 Code
R-PDSO-G16
R-GDIP-T8
Length
10.3 mm
9.955 mm
Low-Offset
YES
Micropower
YES
Neg Supply Voltage Limit-Max
-20 V
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
4
2
Number of Terminals
16
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.4
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
5.08 mm
Slew Rate-Min
0.45 V/us
Slew Rate-Nom
0.7 V/us
9 V/us
Supply Current-Max
1.2 mA
Supply Voltage Limit-Max
20 V
22 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Unity Gain BW-Nom
2800
10000
Voltage Gain-Min
1000000
15000
Width
7.5 mm
7.62 mm
Base Number Matches
2
2
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