TLC556ID
vs
KA556ID
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
GREEN, PLASTIC, MS-012AB, SOIC-14
|
SOP, SOP14,.25
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
IT CAN ALSO OPERATE AT 5V OR 15V NOMINALS
|
CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
|
Analog IC - Other Type |
PULSE; RECTANGULAR
|
PULSE; RECTANGULAR
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e0
|
Length |
8.65 mm
|
8.56 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Frequency-Max |
1.2 MHz
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP14,.25
|
SOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.8 mm
|
Supply Current-Max (Isup) |
1.2 mA
|
|
Supply Voltage-Max (Vsup) |
15 V
|
16 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3.9 mm
|
3.95 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TLC556ID with alternatives
Compare KA556ID with alternatives