TLC552CD
vs
KA555I
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOIC-14
|
0.300 INCH, DIP-8
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
IT CAN ALSO OPERATE AT 1V OR 5V OR 15V OR 18V NOMINALS
|
|
| Analog IC - Other Type |
RECTANGULAR
|
PULSE; RECTANGULAR
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
8.65 mm
|
9.2 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Frequency-Max |
1.2 MHz
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Supply Current-Max (Isup) |
1.6 mA
|
15 mA
|
| Supply Voltage-Max (Vsup) |
18 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
18 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
8
|
2
|
|
|
|
Compare TLC552CD with alternatives
Compare KA555I with alternatives