TLC27M2BCPE4
vs
TLV2262MJGB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TEXAS INSTRUMENTS INC
Package Description
DIP,
DIP, DIP8,.3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.0006 µA
0.0008 µA
Common-mode Reject Ratio-Nom
91 dB
83 dB
Input Offset Voltage-Max
3000 µV
2500 µV
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
Length
9.59 mm
9.58 mm
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Nom
0.43 V/us
0.55 V/us
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
525
710
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
8
Samacsys Manufacturer
Texas Instruments
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
0.00006 µA
Common-mode Reject Ratio-Min
70 dB
Frequency Compensation
YES
Input Offset Current-Max (IIO)
0.00006 µA
JESD-609 Code
e0
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Package Equivalence Code
DIP8,.3
Packing Method
TUBE
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Slew Rate-Min
0.25 V/us
Supply Current-Max
0.5 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Voltage Gain-Min
25000
Wideband
NO
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