TLC27M2ACDG4
vs
LMC6462BIMX/NOPB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP8,.25
SOP, SOP8,.25
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0006 µA
0.00001 µA
Common-mode Reject Ratio-Nom
91 dB
74 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
6500 µV
3000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e3
Length
4.9 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Slew Rate-Nom
0.43 V/us
0.023 V/us
Supply Current-Max
0.8 mA
0.07 mA
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Unity Gain BW-Nom
525
50
Voltage Gain-Min
15000
Wideband
NO
Width
3.9 mm
3.9 mm
Base Number Matches
1
3
Common-mode Reject Ratio-Min
62 dB
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Slew Rate-Min
0.008 V/us
Compare TLC27M2ACDG4 with alternatives
Compare LMC6462BIMX/NOPB with alternatives