TLC277CPE4
vs
TLV2262MJGB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00006 µA
0.0008 µA
Bias Current-Max (IIB) @25C
0.00006 µA
0.00006 µA
Common-mode Reject Ratio-Min
65 dB
70 dB
Common-mode Reject Ratio-Nom
80 dB
83 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
1500 µV
2500 µV
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
JESD-609 Code
e4
e0
Length
9.59 mm
9.58 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
NO
YES
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
TUBE
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Nom
2.9 V/us
0.55 V/us
Supply Current-Max
4.4 mA
0.5 mA
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1700
710
Voltage Gain-Min
10000
25000
Wideband
NO
NO
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Input Offset Current-Max (IIO)
0.00006 µA
Screening Level
MIL-STD-883
Slew Rate-Min
0.25 V/us
Compare TLC277CPE4 with alternatives
Compare TLV2262MJGB with alternatives