TLC2274IPW
vs
LF347BN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
GREEN, PLASTIC, TSSOP-14
|
PLASTIC, DIP-14
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0008 µA
|
0.008 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
100 dB
|
| Input Offset Voltage-Max |
3000 µV
|
8000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
5 mm
|
18.86 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-8 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.2 mm
|
4.69 mm
|
| Slew Rate-Nom |
3.6 V/us
|
13 V/us
|
| Supply Voltage Limit-Max |
8 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
JFET
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
2250
|
4000
|
| Width |
4.4 mm
|
7.62 mm
|
| Base Number Matches |
2
|
10
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Common-mode Reject Ratio-Min |
|
80 dB
|
| Qualification Status |
|
Not Qualified
|
| Voltage Gain-Min |
|
50000
|
|
|
|
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