TLC2274CD
vs
5962-8963501PX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
GREEN, PLASTIC, MS-012AB, SOIC-14
|
DIP,
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.2 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
80 dB
|
| Input Offset Voltage-Max |
3000 µV
|
3000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T8
|
| JESD-609 Code |
e4
|
|
| Length |
8.65 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-8 V
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Nom |
3.6 V/us
|
6 V/us
|
| Supply Voltage Limit-Max |
8 V
|
20 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
2250
|
10000
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare TLC2274CD with alternatives
Compare 5962-8963501PX with alternatives