TLA1E470
vs
USF1E470MCH1TD
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NICHICON CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
47 µF
|
47 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| Leakage Current |
0.01175 mA
|
0.01175 mA
|
| Manufacturer Series |
TLA
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
25 V
|
25 V
|
| Ripple Current |
260 mA
|
200 mA
|
| Surface Mount |
NO
|
NO
|
| Tan Delta |
0.14
|
0.12
|
| Terminal Shape |
WIRE
|
WIRE
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| HTS Code |
|
8532.22.00
|
| JESD-609 Code |
|
e0
|
| Packing Method |
|
AMMO PACK
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TLA1E470 with alternatives
Compare USF1E470MCH1TD with alternatives