TJF1051T/3 vs DP83910AN feature comparison

TJF1051T/3 NXP Semiconductors

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DP83910AN National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description SOP, DIP-24
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
JESD-30 Code R-PDSO-G8 R-PDIP-T24
JESD-609 Code e4 e0
Length 4.9 mm 31.915 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 24
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD SILVER Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 3
Supply Current-Max 70 mA
Technology CMOS

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