TJF1051T/3,118
vs
MCP2562T-E/MF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
Pin Count
8
Manufacturer Package Code
SOT96-1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
10 Weeks
4 Weeks
Samacsys Manufacturer
NXP
Microchip
Data Rate
1000 Mbps
1000 Mbps
JESD-30 Code
R-PDSO-G8
S-PDSO-N8
JESD-609 Code
e4
e3
Length
4.9 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Equivalence Code
SOP8,.25
SOLCC8,.12,25
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1 mm
Supply Current-Max
0.07 mA
70 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
SUPPORT CIRCUIT
CAN TRANSCEIVER
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3 mm
Base Number Matches
1
1
Screening Level
TS 16949
Compare TJF1051T/3,118 with alternatives
Compare MCP2562T-E/MF with alternatives