TJF1051T/1J
vs
MCP2562FD-E/MF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT96-1, SO-8
|
DFN-8
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT96-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
4 Weeks
|
7 Weeks
|
Samacsys Manufacturer |
NXP
|
Microchip
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
JESD-609 Code |
e4
|
e3
|
Length |
4.9 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVSON
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.75 mm
|
1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SUPPORT CIRCUIT
|
CAN FD TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3.9 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Data Rate |
|
8000 Mbps
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
SOLCC8,.12,25
|
Screening Level |
|
TS 16949
|
Supply Current-Max |
|
70 mA
|
|
|
|
Compare TJF1051T/1J with alternatives
Compare MCP2562FD-E/MF with alternatives