TJA1081TS,112 vs TLE8250XSJ feature comparison

TJA1081TS,112 NXP Semiconductors

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TLE8250XSJ Infineon Technologies AG

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Package Description 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16 SOP,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 33 Weeks
Data Rate 10000 Mbps
JESD-30 Code R-PDSO-G16 R-PDSO-G8
JESD-609 Code e3
Length 6.2 mm 5 mm
Moisture Sensitivity Level 1 2A
Number of Functions 1 1
Number of Terminals 16 8
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 2 mm 1.75 mm
Supply Current-Max 0.037 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish MATTE TIN Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm 4 mm
Base Number Matches 1 2
Date Of Intro 2016-07-18

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