TJA1081TS,112
vs
1000BM2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
AT & T MICROELECTRONICS
|
| Package Description |
5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
33 Weeks
|
|
| Data Rate |
10000 Mbps
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
|
| Length |
6.2 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
44
|
| Number of Transceivers |
1
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
|
| Package Equivalence Code |
SSOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
2 mm
|
|
| Supply Current-Max |
0.037 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.3 mm
|
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
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