TJA1081GTS vs 935263364027 feature comparison

TJA1081GTS NXP Semiconductors

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935263364027 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SSOP-16 DIE,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-10-28
Samacsys Manufacturer NXP
JESD-30 Code R-PDSO-G16 R-XUUC-N8
Length 6.2 mm
Number of Functions 1 1
Number of Terminals 16 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SSOP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH UNCASED CHIP
Screening Level AEC-Q100
Seated Height-Max 2 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position DUAL UPPER
Width 5.3 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIE
Pin Count 8
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 935263364027 with alternatives