TJA1059TKJ
vs
TJA1042T/3/1J
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SON
|
SOIC
|
Package Description |
HVSON-14
|
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
|
Pin Count |
14
|
8
|
Manufacturer Package Code |
SOT1086-2
|
SOT96-1
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
NXP
|
NXP
|
JESD-30 Code |
R-PDSO-N14
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
4.5 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
1.75 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Temperature Grade |
|
AUTOMOTIVE
|
|
|
|
Compare TJA1059TKJ with alternatives
Compare TJA1042T/3/1J with alternatives