TJA1057T/1Z
vs
MCP2542FD-E/MF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
DFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
Microchip
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
CAN FD TRANSCEIVER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
4 Weeks
|
| Date Of Intro |
|
2016-03-03
|
| Data Rate |
|
8000 Mbps
|
| JESD-30 Code |
|
S-PDSO-N8
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVSON
|
| Package Equivalence Code |
|
SOLCC8,.12,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
140 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3 mm
|
|
|
|
Compare TJA1057T/1Z with alternatives
Compare MCP2542FD-E/MF with alternatives