TJA1055T/3/CM,118
vs
TJA1055T/3
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, PLASTIC, SOT-108-1, MS-012, SOP-14
SOP, SOP14,.25
Pin Count
14
14
Manufacturer Package Code
SOT108-1
Reach Compliance Code
compliant
compliant
Factory Lead Time
10 Weeks
Samacsys Manufacturer
NXP
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
8.65 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
14
14
Number of Transceivers
1
1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Current-Max
21 mA
0.021 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.39.00.01
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TJA1055T/3/CM,118 vs TJA1055T/C
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TJA1055T/3/CM,118 vs TJA1055T/CM,118
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Compare TJA1055T/3 with alternatives