Findchips: Compare TJA1054T/S900M,518 vs TJA1029TK,118

TJA1054T/S900M,518 vs TJA1029TK,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Package Description	SOP,	3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
Reach Compliance Code	unknown	compliant
JESD-30 Code	R-PDSO-G14	S-PDSO-G8
Length	8.65 mm	3 mm
Number of Functions	1	1
Number of Terminals	14	8
Operating Temperature-Max	125 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	VSSOP
Package Shape	RECTANGULAR	SQUARE
Package Style	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Seated Height-Max	1.75 mm	1 mm
Supply Voltage-Nom	5 V	5 V
Surface Mount	YES	YES
Telecom IC Type	INTERFACE CIRCUIT	INTERFACE CIRCUIT
Temperature Grade	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	3 mm
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		SON
Pin Count		8
Manufacturer Package Code		SOT782-1
Factory Lead Time		10 Weeks
Samacsys Manufacturer		NXP
Moisture Sensitivity Level		1
Peak Reflow Temperature (Cel)		260
Screening Level		AEC-Q100
Time@Peak Reflow Temperature-Max (s)		30
	Telecommunication Circuits » Network Interfaces	Telecommunication Circuits » Network Interfaces