TJA1054T/S900 vs TJA1055T/3/1J feature comparison

TJA1054T/S900 NXP Semiconductors

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TJA1055T/3/1J NXP Semiconductors

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, PLASTIC, SOT-108-1, MS-012, SOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Number of Functions 1 1
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT108-1
Factory Lead Time 10 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e4
Moisture Sensitivity Level 1
Number of Transceivers 1
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) 260
Supply Current-Max 21 mA
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Time@Peak Reflow Temperature-Max (s) 30

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