TJA1050T/N1M,518
vs
TLE9250VLE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP8,.25
|
TSON-8
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT96-1
|
|
Reach Compliance Code |
unknown
|
compliant
|
Data Rate |
1000 Mbps
|
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
Length |
4.9 mm
|
3 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HTSON
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.75 mm
|
1.1 mm
|
Supply Current-Max |
75 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.39.00.01
|
Date Of Intro |
|
2017-08-17
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
2A
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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