TJA1043TKY
vs
TLE9250LEXUMA1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
SON
|
|
| Package Description |
3 X 4.50 MM, 0.85 MM HEIGHT,GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
|
HTSON,
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT1086-2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
10 Weeks
|
39 Weeks
|
| Samacsys Manufacturer |
NXP
|
Infineon
|
| Data Rate |
1000 Mbps
|
|
| JESD-30 Code |
R-PDSO-G14
|
S-PDSO-N8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.5 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
2A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
8
|
| Number of Transceivers |
1
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSSOP
|
HTSON
|
| Package Equivalence Code |
SOLCC14,.12,25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Supply Current-Max |
65 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TJA1043TKY with alternatives
Compare TLE9250LEXUMA1 with alternatives