TJA1041AT/M,112 vs TLE6251-3G feature comparison

TJA1041AT/M,112 NXP Semiconductors

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TLE6251-3G Infineon Technologies AG

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code unknown compliant
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.75 mm
Number of Functions 1 1
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
HTS Code 8542.39.00.01
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
Moisture Sensitivity Level 2A
Number of Transceivers 1
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Technology BICMOS
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TLE6251-3G with alternatives