TJA1029TK/20/1J
vs
HI-3110PSHF
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HOLT INTEGRATED CIRCUITS INC
|
Part Package Code |
SON
|
|
Package Description |
3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
|
SOP,
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT782-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G18
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
11.55 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
2.05 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2016-04-04
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-55 °C
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare TJA1029TK/20/1J with alternatives
Compare HI-3110PSHF with alternatives